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The TO-252 package — everyone calls it DPAK — is a 6.10 mm × 6.58 mm molded body with three gullwing leads on 2.286 mm

The TO-251 package, sold almost everywhere as IPAK, is a three-lead through-hole outline with a molded body around 6.1 mm by 6.6 mm by 2.3

The TO-247-4L package is the four-lead version of the TO-247 outline, and the fourth pin is a Kelvin source that gives the gate driver its

The TO-247-3 package is the three-lead member of the JEDEC TO-247 through-hole family: roughly 21 mm by 16 mm of molded body, leads on a

The TO-247 package is a through-hole power outline roughly 20 mm × 15.5 mm with three or four leads on 5.46 mm pitch and a

The TO-243 package is what JEDEC calls the package the rest of the industry calls SOT-89, and JEITA calls SC-62. It is a 4.5 mm

The TO-237 package is a registered JEDEC transistor outline titled “Header Family, Flat Index,” last revised to Issue B in October 1979. It is not,

The TO-220F package is a TO-220 with the mounting tab moulded inside the plastic, so it bolts to a grounded heatsink with no washer and

TO-220AB is the JEDEC designation for the three-straight-lead TO-220 package. The AB suffix names a lead count against a dimensional spec — not a larger

The TO-220-5 package is the five-lead member of the TO-220 family: the same roughly 10 mm body and bolt-down tab, with leads on 1.7 mm