Blog

The TO-72 package is the four-lead member of the TO-18 metal can family, registered by JEDEC as TO-206AF. Body dimensions match TO-18 exactly; the extra

The TO-5 package is a hermetic metal can with leads on a 5.08 mm pin circle and a locating tab 45° from pin 1. JEDEC registers

The TO-66 package is a hermetic two-lead metal can built on a diamond-shaped mounting flange, registered by JEDEC as TO-213AA, with the case acting as

The TO-46 package is a hermetic metal can roughly 5.4 mm across the base, with three leads on a 2.54 mm pin circle and a cap

The TO-3PF package is a fully moulded three-lead power package on a 5.45 mm lead pitch, with the mounting tab encapsulated in epoxy rather than exposed.

The TO-3P package is a three-lead plastic power package on a 5.45 mm lead pitch, with an exposed metal tab and a single ø3.2 mm mounting

The TO-39 package is a hermetic metal can with a 8.51–9.40 mm base flange, three leads on a 5.08 mm pin circle, and a locating tab.

The TO-3 package is a hermetic diamond-shaped metal can for power semiconductors, registered by JEDEC as the TO-204 family. Two glass-sealed pins pass through the base

The TO-268, commonly called D3PAK (Decawatt 3 Package), is the largest surface-mount package in the JEDEC DPAK family. Sitting above the TO-252 (DPAK) and TO-263

The TO-264 is the largest standard through-hole power package in the JEDEC transistor-outline family. Registered as SOT-199 and designated TO-264AA in JEDEC Publication 95, it