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A narrow-body SOIC land pattern uses 0.60 mm × 1.55 mm pads on 1.27 mm pitch, with 5.40 mm between the two pad rows measured

An SO-8 package is an 8-lead gull-wing surface-mount body on 1.27 mm pitch, 3.90 mm wide, 4.90 mm long, and 1.75 mm tall at most,

An SO-16 package is a 16-lead gull-wing surface-mount body on 1.27 mm pitch, and it ships in two widths that are not interchangeable: a 3.90

The SO-14 package most engineers mean is JEDEC MS-012 variation AB: fourteen gull-wing leads on 1.27 mm pitch, a body 8.55 mm to 8.75 mm

The QSOP-28 package holds 28 gull-wing leads on 0.635 mm pitch in a body 9.80 mm to 10.01 mm long and 3.81 mm to 4.01

The QSOP-20 package is a 20-lead gull-wing plastic package on 0.635 mm (25 mil) pitch, 3.81 mm to 3.99 mm wide, 8.56 mm to 8.76

The QSOP-24 package puts 24 gull-wing leads on 0.635 mm pitch in an 8.56 mm to 8.76 mm body that is 3.81 mm to 4.01

A QSOP-16 package has a 4.80 mm to 5.00 mm body, a 5.79 mm to 6.20 mm lead span and 16 gull-wing leads on a

A QSOP package is a gull-wing surface-mount package on a 0.635 mm pitch with a 3.9 mm body, registered as JEDEC MO-137. The name is

A PSOP package is one of two unrelated things. Amkor’s Power Small Outline Package is a wide-body SOIC with a copper heat slug under the