The MSOP-8 package is an 8-lead Mini Small Outline Package with a 3.0 mm × 3.0 mm body, a 0.65 mm lead pitch, and a maximum height of 1.10 mm, registered to JEDEC MO-187 Variation AA. Texas Instruments sells it as VSSOP-8 (package code DGK); Maxim calls the same body µMAX. This page gives the full dimensions, the pin numbering with a real pinout, and a recommended land pattern.
Key takeaways
- The MSOP-8 body is 3.0 × 3.0 mm, about 4.9 mm wide including the gull-wing leads, and 1.10 mm tall at most.
- Lead pitch is 0.65 mm — wider than the MSOP-10’s 0.50 mm, so the two are not footprint-compatible despite sharing a 3.0 × 3.0 mm body.
- The same package goes by several names: VSSOP-8 (TI), µMAX (Maxim), micro SOIC (Analog Devices), and MiniSO (National).
- An exposed-pad version exists — TI’s DGN, the MSOP-8 PowerPAD — adding a ground-tied thermal pad for power parts.
- Pin numbering runs counterclockwise from the top-left: 1–4 down the left side, 5–8 up the right.
MSOP-8 dimensions
The MSOP-8 measures 3.0 mm × 3.0 mm in body size, 4.90 mm wide across the gull-wing leads, and 1.10 mm tall at most, with a molded body about 0.85 mm thick and a 0.65 mm lead pitch. It is registered to JEDEC MO-187 Variation AA.
| Symbol | Dimension | Value (mm) |
| A | Overall height (max) | 1.10 |
| A1 | Standoff | 0.00–0.15 |
| A2 | Molded body thickness | 0.75–0.95 (0.85 nom) |
| b | Lead width | 0.25–0.35 |
| c | Lead thickness | 0.10–0.20 |
| D | Body length | 2.90–3.10 (3.00 nom) |
| E | Overall width (incl. leads) | 4.90 (4.65–5.15) |
| E1 | Body width | 2.90–3.10 (3.00 nom) |
| e | Lead pitch | 0.65 BSC |
| L | Foot length | 0.40–0.80 (0.55 nom) |
Values are from the Analog Devices 8-lead MSOP drawing (RM-8) and Monolithic Power’s MF-PO-D-0020, both compliant with JEDEC MO-187 Variation AA.
MSOP-8 pinout: how the pins are numbered
An MSOP-8 has four leads per side. Pin 1 is at the top-left, marked by a half- or full-circle index, and the count runs counterclockwise: pins 1 to 4 down the left edge, then 5 to 8 up the right. The numbering is fixed by the package; the pin functions come from the device.
Two arrangements dominate. Dual op-amps use the standard 8-pin layout (out A, −in A, +in A, V−, +in B, −in B, out B, V+). Power and interface parts assign function by design, so take them from the datasheet.
| Pin | Name | Function (example: TI TPS2061C, DGK) |
| 1 | GND | Ground |
| 2, 3 | IN | Input voltage / power-switch drain |
| 4 | EN | Enable input |
| 5 | FLT | Active-low fault flag |
| 6, 7, 8 | OUT | Power-switch output |
Pin functions shown from the TI TPS2061C datasheet. On the PowerPAD (DGN) version of this part, the exposed pad is internally connected to GND.
The naming map: VSSOP-8, µMAX, and the exposed-pad version
One footprint ships under several names, and datasheets and distributor listings do not always agree.
- Texas Instruments calls it VSSOP-8; the package code is DGK.
- Maxim uses µMAX; Analog Devices has used micro SOIC; the former National Semiconductor line used MiniSO.
- The exposed-pad version is TI’s DGN, the MSOP-8 PowerPAD, which adds a thermal pad on the underside tied to ground.
A correction worth stating: the plain MSOP-8 and VSSOP-8 have gull-wing leads, not bottom pads. Any listing that calls the DGK “leadless” or gives it a thermal pad is describing the DGN or a different package.
The thermal difference is real. TI specifies the plain DGK at about 110 °C/W junction-to-ambient, while the DGN’s exposed pad, soldered to copper, runs far cooler — a TI application note measured the 8-pin HVSSOP PowerPAD about 48 °C cooler per watt than a package without the pad.
MSOP-8 footprint and land pattern
The land pattern is eight pads at 0.65 mm pitch, four per side, with no center pad on the plain DGK. Manufacturers publish a suggested pattern and reference IPC-7351A; a wave-solder version adds 0.2 mm to the toe (Z) dimension.
| Feature | Value |
| Pad pitch | 0.65 mm |
| Pads | 8 (4 per side) |
| Pad size | ~1.10 mm × 0.35 mm |
| Overall land envelope | ~5.80 mm × 3.60 mm |
Signal-pad values follow Richtek’s MSOP-8 footprint drawing. For the DGN (PowerPAD) version, add a central thermal land under the exposed pad and tie it to an inner ground plane with vias.
MSOP-8 vs SOIC-8 vs TSSOP-8
The MSOP-8 competes with two other common 8-pin packages. The table places it against them on the parameters that decide board area and assembly.
| Attribute | MSOP-8 / VSSOP-8 | SOIC-8 (D) | TSSOP-8 (PW) |
| Lead pitch | 0.65 mm | 1.27 mm | 0.65 mm |
| Body size | 3.0 × 3.0 mm | 3.9 × 4.9 mm | 3.0 × 3.0 mm |
| Height (max) | 1.10 mm | 1.75 mm | 1.20 mm |
| Hand-solder | Feasible | Easy | Feasible |
| Exposed-pad option | Yes (DGN) | Some | Yes (HTSSOP) |
MSOP-8 and TSSOP-8 share the 0.65 mm pitch and a similar footprint, while SOIC-8 is larger and easier to hand-solder at 1.27 mm. Choose MSOP-8 to save board area over SOIC-8 while keeping a pitch a technician can still rework by hand.
Real parts and sourcing
The MSOP-8 is one of the most common small-signal packages, so sourcing is easy. Op-amps, references, current-sense amplifiers, and interface parts ship in it across vendors, in DGK (TI), µMAX (Maxim), and MS8 (Analog Devices / Linear); the TI TPS2061C power switch offers both DGK and the DGN PowerPAD. Because MSOP-8 sits next to SOIC-8 and TSSOP-8 in most catalogs, a given function usually has a second source in a nearby package. Confirm on the datasheet whether the part is the plain DGK or the exposed-pad DGN, since the pad changes the footprint and the thermal design.
Frequently asked questions
What are the dimensions of an MSOP-8?
An MSOP-8 has a 3.0 mm × 3.0 mm body, is 4.90 mm wide across the gull-wing leads, and stands 1.10 mm tall at most, with a molded thickness near 0.85 mm and a 0.65 mm lead pitch. It is registered to JEDEC MO-187 Variation AA.
What is the pitch of an MSOP-8 package?
The MSOP-8 uses a 0.65 mm lead pitch. That is wider than the MSOP-10’s 0.50 mm, so an MSOP-8 and an MSOP-10 are not footprint-interchangeable despite sharing the 3.0 × 3.0 mm body.
Is MSOP-8 the same as VSSOP-8?
Yes. VSSOP-8 is Texas Instruments’ name for the MSOP-8; its package code is DGK. Maxim calls the same body µMAX and Analog Devices has used micro SOIC. The exposed-pad version is TI’s DGN, the MSOP-8 PowerPAD.
How are MSOP-8 pins numbered?
Pin 1 is at the top-left, marked by a half- or full-circle index. The count runs counterclockwise: pins 1 to 4 down the left side, then 5 to 8 up the right. Pin functions are set by the device, not the package.
What is the difference between DGK and DGN?
DGK is the plain 8-pin VSSOP with gull-wing leads and no thermal pad. DGN is the same body with an exposed PowerPAD thermal pad on the underside, tied to ground and soldered to a copper pour for heat. They are not footprint-interchangeable.
Can you hand-solder an MSOP-8?
Yes. At 0.65 mm pitch the MSOP-8 is soldered by hand with a fine-tip iron, flux, and magnification, or by drag-soldering. It is easier than finer-pitch parts, though a stencil and reflow give the best yield in production.
What to do next
Reach for an MSOP-8 when you need an 8-pin small-signal part in a 3.0 mm body under 1.10 mm tall at 0.65 mm pitch, a pitch your line can place by hand if needed. Decide whether the function needs the plain DGK or the exposed-pad DGN, since the pad changes both the footprint and the thermal path. Draw the land pattern from the datasheet and IPC-7351A, take the pinout from the specific part such as the TPS2061C, and mark pin 1 clearly, because the footprint is symmetric.
