An LQFP-80 package has 20 gull-wing leads per side, a 1.40 mm thick body, and 1.60 mm maximum height. Everything else moves. The 80-lead low-profile quad flat package ships on 14 x 14 mm at 0.65 mm pitch, 12 x 12 mm at 0.50 mm pitch and 10 x 10 mm at 0.40 mm pitch, and each one demands a different land pattern and a different escape-routing plan. Here are the verified numbers.

Key takeaways

• The 14 x 14 mm version is the volume part: 16.00 mm BSC lead span, 0.65 mm pitch, 1.40 mm body, per Microchip drawing C04-054 Rev A.
• The 12 x 12 mm, 0.50 mm pitch version is registered as JEDEC MS-026 variation BDD, per Renesas drawing Q80.12X12B.
• Holtek publishes land spans of 15.4 mm BSC (14 x 14), 13.4 mm BSC (12 x 12) and 11.4 mm BSC (10 x 10) for the three geometries.
• Pitch decides your routing, not your pin count. Only the 0.65 mm pitch part leaves room for a signal trace between adjacent lands under standard 0.10 mm design rules.
• An 80-lead PQFP on a 14 x 20 mm body at 0.80 mm pitch is a different package with a rectangular footprint. Check the body dimensions before reusing a library part.

What the LQFP-80 name fixes

Low-profile quad flat package describes a plastic body with gull-wing leads on all four sides and a molded thickness of 1.40 mm. Maximum overall height including standoff is 1.60 mm. The 80 counts leads, so each side carries 20.

Body size and lead pitch sit outside the name. That is the whole difficulty with this package. JEDEC registration MS-026 covers the family, and its three-letter variation codes carry the body size, thickness class and lead count. Renesas ties its 80-lead 12 x 12 mm outline to MS-026 variation BDD in drawing Q80.12X12B, where the B in the first position marks the 1.40 mm low-profile class.

A part described only as LQFP-80 in a distributor filter or a BOM line is therefore incomplete. Two devices under that label can differ by 4 mm across the body and by 0.25 mm in pitch.

LQFP-80 dimensions by body size

Three square geometries are in current production, plus one rectangular PQFP that shares the lead count. Pitch falls as the body shrinks, since 20 leads per side have to fit within the molded edge.

Body	Pitch	Lead span	Body / max height	Registration or reference	Leads per side
14 x 14 mm	0.65 mm	16.00 mm BSC	1.40 / 1.60 mm	Microchip C04-054 Rev A	20
12 x 12 mm	0.50 mm	per vendor drawing	1.40 / 1.60 mm	JEDEC MS-026-BDD (Renesas Q80.12X12B)	20
10 x 10 mm	0.40 mm	12.00 mm nominal	1.40 / 1.60 mm	IPC name QFP40P1200X1200X160-80N	20
14 x 20 mm (PQFP)	0.80 mm	per vendor drawing	thicker class	Holtek QFP 80 (14 x 20) entry	20

Microchip drawing C04-054 Rev A gives the full dimension set for the 14 x 14 mm part: molded body D1 = E1 = 14.00 mm BSC, overall D = E = 16.00 mm BSC, lead pitch e = 0.65 mm BSC, molded thickness A2 = 1.35 / 1.40 / 1.45 mm, overall height A = 1.60 mm maximum, standoff A1 = 0.05 to 0.15 mm, foot length L = 0.45 / 0.60 / 0.75 mm, lead width b = 0.22 mm nominal, and foot angle 0 to 7 degrees.

Lead coplanarity on this family runs to 0.08 mm maximum, the same figure Analog Devices marks on its LQFP outlines. On a part with 80 feet, one lead outside that band opens a single joint while its neighbors look perfect, which is why cold joints on quad flat packs get diagnosed as software faults for a week before anyone reaches for a microscope.

LQFP-80 pinout and orientation

Numbering follows the JEDEC quad convention. Pin 1 sits at the top left in the top view, next to the index feature, and the count runs counter-clockwise. With 20 leads per side, the corner pins are 1, 20, 21, 40, 41, 60, 61 and 80.

That corner arithmetic is worth memorizing, because it is the fastest way to catch a rotated footprint during review. If your schematic symbol shows pin 21 anywhere except the start of the second side, the library part came from a different pin count.

Pinout figures in datasheets are top views. Placing an LQFP-80 on the bottom side of a board needs the footprint mirrored rather than rotated 180 degrees, and the difference shows up as a package that solders down with pin 1 diagonally opposite where it belongs. Add a chamfered silkscreen corner outside the courtyard, since a printed pin-1 dot inside the body outline disappears under a 14 mm package.

Function assignment is device-specific and does not port between pin counts within a family. Peripherals that get dedicated pins on a 100-lead or 144-lead part frequently share pads on the 80-lead version, so verify against the pin definition table in the device datasheet rather than a generic diagram.

LQFP-80 footprint and land pattern

The Holtek footprint guide, revision 1.10 dated 13 August 2025, publishes land data for all three square geometries. D and W are the outer land span, x is pad width and y is pad length, in millimeters.

Variant	Pitch (e)	Land span D = W	Pad width x (max)	Pad length y	Gap between lands
LQFP-80, 14 x 14 mm	0.65 BSC	15.4 BSC	0.40	1.65	0.25 mm
LQFP-80, 12 x 12 mm	0.50 BSC	13.4 BSC	0.30	1.65	0.20 mm
LQFP-80, 10 x 10 mm	0.40 BSC	11.4 BSC	0.25	1.65	0.15 mm
PQFP-80, 14 x 20 mm	0.80 BSC	17.0 x 23.0 BSC	0.50	2.25	0.30 mm

The gap column is pitch minus pad width, computed from the Holtek values. It is the number that decides how you get 80 signals off the part.

Escape routing, worked through

Take a fabricator working to 0.10 mm trace and 0.10 mm space, which is standard capability and standard pricing. A trace routed between two adjacent lands consumes 0.10 mm of copper plus 0.10 mm of clearance on each side, so it needs 0.30 mm of gap.

• 14 x 14 mm at 0.65 mm pitch: 0.25 mm gap. A 0.10 mm trace fits with 0.075 mm clearance each side, which needs a 0.075 mm rule waiver or a 0.08 mm trace. Tight, and routinely done.
• 12 x 12 mm at 0.50 mm pitch: 0.20 mm gap. A 0.08 mm trace with 0.06 mm clearance is the only way through, so most designs stop escaping between pads and drop vias outside the courtyard instead.
• 10 x 10 mm at 0.40 mm pitch: 0.15 mm gap. Nothing routes between the lands at standard rules. Plan on via-in-pad or a two-row dogbone fanout from the start.

Pick the body size against that table before the schematic is frozen. Choosing the 10 x 10 mm part to save 96 square millimeters and then discovering you need HDI is a bad trade on almost any board that is not phone-sized.

IPC-7351B naming and density level

The 14 x 14 mm part names as QFP65P1600X1600X160-80N under IPC-7351B: quad flat package, 0.65 mm pitch, 16.00 x 16.00 mm nominal lead span, 1.60 mm height, 80 pins, nominal density. The final letter is the density level, and library tools set it silently. M is most material (level A), N is nominal (level B), L is least material (level C).

• Level A / M: hand rework, mixed assembly, or class 3 hardware. Longest toe fillet, largest courtyard.
• Level B / N: default for reflow-assembled commercial boards.
• Level C / L: only under real density pressure, and only after your assembler agrees on a fine-pitch part.

NXP application note AN4388 on quad flat packages states the goal plainly: the lead foot should sit roughly centered on the pad with equal pad extension at toe and heel. Check any library footprint against that before release, since generated patterns sometimes bias the pad inboard and starve the toe fillet that inspection relies on.

Assembly, stencil and shipping media

Stencil aperture sets yield on fine-pitch quad packages. At 0.65 mm pitch a 1:1 aperture on a 0.40 x 1.65 mm pad works with Type 3 powder. At 0.50 mm and below, pull the aperture back around 10 percent on width and move to Type 4, since the area ratio on a 0.25 mm wide aperture falls near the release limit for a 0.100 mm stencil.

Shipping media decides feeder availability. STMicroelectronics technical note TN1206 lists the 80-lead LQFP on a 14 x 14 mm body as package code 1S, shipped on 32 mm tape with 24 mm tape pitch, grouped with the other 14 x 14 mm QFP parts. Confirm that width against your assembler feeder list at quote time rather than at kitting.

Plastic quad flat packages carry a moisture sensitivity level classified per J-STD-020 with floor life per J-STD-033. MSL varies by device and mold compound inside a single package family, so read the level off the device datasheet and bake to the dry-pack label rather than to habit. A 14 mm body that has absorbed moisture delaminates at reflow peak, and the failure looks like a marginal solder joint.

Mistakes that send LQFP-80 boards back

• Reusing an LQFP-80 library footprint across body sizes, which lands a 0.65 mm pitch part on a 13.4 mm span pattern.
• Treating the 14 x 20 mm 80-lead PQFP as the same part. It is rectangular, on 0.80 mm pitch, with 0.50 x 2.25 mm pads.
• Committing to the 0.40 mm pitch body before checking whether the fanout survives at standard fabrication rules.
• Rotating a footprint for bottom-side placement instead of mirroring it.
• Copying pin functions from a 100-lead sibling, where peripherals that share a pad on the 80-lead device have their own pins.
• Leaving a 1:1 stencil aperture on a 0.25 mm wide pad, which either bridges or starves depending on how the paste releases that day.

Frequently asked questions

What are the dimensions of an LQFP-80 package?

The most common version is a 14 x 14 mm body with a 16.00 mm BSC lead span on 0.65 mm pitch, 1.40 mm molded thickness and 1.60 mm maximum height, per Microchip drawing C04-054 Rev A. Versions on 12 x 12 mm at 0.50 mm pitch and 10 x 10 mm at 0.40 mm pitch also exist, all with 20 leads per side.

What is the pin pitch of an LQFP-80?

It depends on body size: 0.65 mm on 14 x 14 mm, 0.50 mm on 12 x 12 mm, and 0.40 mm on 10 x 10 mm. An 80-lead PQFP on a 14 x 20 mm body uses 0.80 mm pitch. Read the package code in the orderable part number before placing a footprint.

What is the LQFP-80 footprint size?

For the 14 x 14 mm part, Holtek specifies a 15.4 mm BSC land span with 0.40 mm wide by 1.65 mm long pads. The 12 x 12 mm part uses 13.4 mm BSC with 0.30 x 1.65 mm pads, and the 10 x 10 mm part uses 11.4 mm BSC with 0.25 x 1.65 mm pads.

How are LQFP-80 pins numbered?

Pin 1 is at the top left of the top view beside the index feature, and numbering runs counter-clockwise with 20 leads per side. Corner pins are 1, 20, 21, 40, 41, 60, 61 and 80. Datasheet pinout figures are top views, so bottom-side placement requires a mirrored footprint.

Is LQFP-80 the same as TQFP-80?

No. LQFP is 1.40 mm thick with 1.60 mm maximum height; TQFP is 1.00 mm thick with 1.20 mm maximum height. Where both exist on the same body and pitch, the land pattern is identical and only vertical clearance changes, which matters under shield cans and in stacked assemblies.

Can an LQFP-80 be hand-soldered?

The 14 x 14 mm part at 0.65 mm pitch drag-solders comfortably with flux and a fine tip. The 12 x 12 mm part at 0.50 mm pitch is workable with practice. The 10 x 10 mm part at 0.40 mm pitch needs hot air, a microscope and a footprint built at IPC density level A.

What to specify

Default to the 14 x 14 mm, 0.65 mm pitch LQFP-80 on a nominal-density land pattern with a 15.4 mm span and 0.40 x 1.65 mm pads. It escapes on two layers at standard fabrication rules, reworks by hand, and ships on 32 mm tape that every assembler already stocks.

Move to 12 x 12 mm only when board area is genuinely binding, and budget for fanout vias outside the courtyard. Take the 10 x 10 mm, 0.40 mm pitch version only with via-in-pad in the stackup budget and a fabricator quote in hand.

Before release, run three checks: read the body size out of the orderable part number, compare the library land span against the vendor drawing, and confirm the tape width with your assembler. Those three catch nearly every LQFP-80 respin.

[IMAGE 1: dimensioned top and side view of an 80-lead LQFP on a 14 x 14 mm body showing 16.00 mm lead span, 0.65 mm pitch and 1.40 mm thickness | alt: “LQFP-80 package dimensions showing 14 x 14 mm body, 16.00 mm lead span and 0.65 mm pitch”]

[IMAGE 2: recommended land pattern with 15.4 mm span and pad dimensions called out | alt: “LQFP-80 footprint land pattern with 15.4 mm span and 0.40 by 1.65 mm pads”]

[IMAGE 3: top view pin numbering with corner pins 1, 20, 21, 40, 41, 60, 61 and 80 labeled | alt: “LQFP-80 pinout numbering counter-clockwise with 20 leads per side”]

Sources

• Microchip Technology, drawing C04-054 Rev A, 80-Lead Low-profile Plastic Quad Flatpack (PT), 14 x 14 mm body [LQFP].
• Renesas, package drawing Q80.12X12B, 80-pin LQFP, JEDEC MS-026 variation BDD.
• Holtek Semiconductor, Recommended Footprints for QFP Series, User Guide Rev. 1.10, 13 August 2025.
• STMicroelectronics, TN1206, Tape and reel shipping media for STM8 and STM32 microcontrollers in QFP packages.
• NXP Semiconductors, AN4388 Rev. 2.0, Quad Flat Package (QFP) application note.
• Analog Devices, LQFP outline drawings ST-64-2 and SW-64-2 (coplanarity and lead-frame limits for the family).
• JEDEC Publication 95, registration MS-026, Low Profile Plastic Quad Flat Package.
• [INTERNAL LINK: LQFP-64 package dimensions, pinout and footprint -> adjacent pin count in the same family]
• [INTERNAL LINK: PCB footprint creation step by step -> building the land pattern]
• [INTERNAL LINK: paste layer design for thermal pads -> stencil aperture and paste coverage]
• [INTERNAL LINK: FPGA pin swapping and layout-driven I/O assignment -> escape routing and pin assignment]