A DIP-8 package is an 8-lead dual in-line component on a 2.54 mm (0.1 in) pitch, with a 7.62 mm (300 mil) row spacing as the default width under JEDEC MS-001. That default isn’t universal: at least one manufacturer registers a wider DIP-8A variant, and several power-IC vendors ship 8-lead DIP outlines under their own package codes that aren’t drop-in interchangeable.

Key takeaways

• Standard DIP-8 follows JEDEC MS-001: 2.54 mm pitch, 7.62 mm (300 mil) nominal row spacing, body roughly 9.0–9.5 mm × 6.1–6.4 mm.
• A wider DIP-8A variant exists from at least one manufacturer — don’t assume every “DIP-8” part matches the 300 mil default.
• Manufacturer-specific 8-lead DIP power packages (e.g., Infineon’s PG-DIP-8-13 and PG-DIP-8-905) are registered as distinct outlines, not generic DIP-8.
• Pin 1 sits at the top-left next to a notch or dot; numbering runs counter-clockwise.
• Classic DIP-8 parts include the NE555 timer and LM741 op-amp — both still shipped in this package today.

What a DIP-8 package is

DIP-8 is a through-hole IC package with two rows of four pins each, for a total of eight leads on a 2.54 mm pitch. It’s part of the same JEDEC dual in-line family as larger DIP packages, registered under MS-001 for the narrow 300 mil body width. Classic analog and timer ICs standardized on this package early — the NE555 precision timer and LM741 operational amplifier are both still available in DIP-8 today, alongside SOIC-8 surface-mount equivalents.

DIP-8 dimensions (JEDEC MS-001)

The Analog Devices N-8 package drawing, compliant to JEDEC MS-001, gives the controlling dimensions in inches with millimeter equivalents for reference only — use the inch values for design, not the rounded metric conversions.

Parameter	JEDEC MS-001 (N-8)	Notes
Row spacing (e1)	7.62–10.92 mm (0.300–0.430 in span)	7.62 mm (300 mil) is the nominal seating width
Lead pitch	2.54 mm (0.100 in) BSC	Fixed across all standard DIP-8 variants
Body width	6.10–6.35 mm (0.240–0.250 in)	Measured across the plastic body, not the leads
Body length	9.02–9.27 mm (0.355–0.365 in)
Max height (seated)	5.33 mm (0.210 in) max	Measured from seating plane to top of package
Lead width	0.36–0.56 mm (0.014–0.022 in)

Design rule: the 300 mil row spacing is the default assumption for “DIP-8,” but it is not guaranteed. Confirm row spacing against the specific part’s datasheet before ordering a socket or finalizing a footprint.

The DIP-8 variant problem

Generic “DIP-8” covers more ground than most reference pages admit. Vishay’s own package drawings list both a DIP-8 and a wider DIP-8A outline side by side, with different body lengths and pin-1 identifier dimensions. Separately, Infineon registers multiple 8-lead through-hole DIP packages under distinct part numbers — PG-DIP-8-13 for Fixed Frequency and Quasi Resonant CoolSET parts, and PG-DIP-8-905 for gate driver and lighting ICs — rather than a single generic DIP-8 outline.

The practical effect: an 8-pin count alone does not guarantee footprint compatibility across manufacturers or part families. Power ICs in particular are more likely to use a manufacturer-specific 8-lead DIP variant than the narrow-body signal/analog default.

Pin numbering and orientation

Pin 1 is marked by a notch, dot, or both on one end of the package, and numbering runs counter-clockwise from the top-left when the notch faces up. For DIP-8, pins 1–4 run down the left column and pins 5–8 run back up the right column, with pin 8 sitting directly across from pin 1.

Land pattern (IPC-7351)

Diodes Inc. publishes a suggested land pattern for PDIP-8 built on IPC-7351A conventions rather than a generic formula estimate — useful because the pad geometry differs from the package body dimensions above.

Dimension	Min (mm)	Max (mm)
A — overall land length	9.02	9.53
B — overall land width	6.15	6.35
L — row spacing (pad centers)	7.62	8.26
G — pad pitch	2.54 typ.	2.54 typ.

Diodes Inc. notes that a more robust pattern for wave soldering adds 0.2 mm to the outer pad dimension; for hand-soldered or reflow-only boards, the nominal land pattern above is sufficient. Always cross-check the land pattern against your specific part’s datasheet, since suggested patterns vary slightly by manufacturer even for the same body outline.

When DIP-8 makes sense vs. SMT

DIP-8 remains common for prototyping, hobbyist builds, and any board where hand-soldering or socketing is the priority — through-hole mounting gives mechanical strength and easy replacement that surface mount doesn’t. For production volume, SOIC-8 is the direct surface-mount equivalent at a narrower 3.9 mm body width and 1.27 mm lead pitch, occupying roughly 30–50% less board area than the equivalent DIP. Adapter boards exist specifically to convert an SOIC-8 part back to a DIP-8 footprint for breadboarding, confirming these two packages are the standard migration pair for this pin count.

Socket selection

Order a DIP-8 socket by pitch and row spacing together, not pin count alone. A standard 300 mil, 0.1 in pitch DIP-8 socket will not correctly seat a wider DIP-8A part or a manufacturer-specific power package registered under a different outline code. When in doubt, match the socket to the exact package drawing in the datasheet rather than the generic “DIP-8” label.

FAQ

What is the standard size of a DIP-8 package?

The JEDEC MS-001 body is roughly 9.0–9.5 mm long by 6.1–6.4 mm wide, with a 2.54 mm lead pitch and 7.62 mm (300 mil) nominal row spacing. Some manufacturers register wider or narrower variants under separate part numbers.

What is the pin spacing on a DIP-8?

The lead pitch is 2.54 mm (0.1 in) between adjacent pins in the same row, fixed across standard DIP-8 variants.

How do you find pin 1 on a DIP-8?

Look for a notch or dot at one end of the package. With the notch facing up, pin 1 is the top-left pin, and numbering runs counter-clockwise around the package.

Is DIP-8 the same across all manufacturers?

Not always. Most analog and timer ICs follow the JEDEC MS-001 300 mil outline, but some manufacturers register wider variants (e.g., DIP-8A) or entirely separate 8-lead DIP outlines for power packages.

What replaces DIP-8 in surface-mount designs?

SOIC-8 is the direct pin-count equivalent for surface mount, at roughly 30–50% less board area than DIP-8.

Decision

Before ordering a socket or finalizing a footprint for an 8-pin DIP part, confirm the exact package drawing in the datasheet rather than assuming the 300 mil JEDEC MS-001 default — especially for power ICs, where manufacturer-specific 8-lead DIP outlines are common. For new designs where board space matters, default to SOIC-8 and reserve DIP-8 for prototyping, socketed test fixtures, or hand-assembly.