The LQFP-64 package usually means a 10 x 10 mm body on 0.5 mm pitch, 1.40 mm thick, registered as JEDEC MS-026 variation BCD. Usually is the trap: 14 x 14 mm and 7 x 7 mm versions carry the same 64-lead name and land on different footprints. Below are the verified dimensions, the pin-numbering rules, the recommended land patterns, and the failure modes that put fine-pitch boards on the rework bench.

Key takeaways

• The default LQFP-64 is 10 x 10 mm body, 12.00 mm lead span, 0.50 mm pitch, 1.40 mm body thickness, 1.60 mm maximum height.
• That geometry is JEDEC MS-026 variation BCD. The 1.20 mm-tall sibling on the same outline is variation ACD, and it is a TQFP.
• Holtek publishes a 11.4 mm BSC land span for the 10 x 10 mm part, with 0.30 mm wide by 1.65 mm long pads.
• In IPC-7351B naming, the standard part is QFP50P1200X1200X160-64N.
• A 64-lead LQFP also exists at 14 x 14 mm on 0.8 mm pitch and at 7 x 7 mm on 0.4 mm pitch. Read the package code in the orderable part number before you place the footprint.

What LQFP-64 specifies, and what it leaves open

LQFP stands for low-profile quad flat package. It is a gull-wing leaded plastic package with leads on all four sides. The low-profile qualifier fixes one number only: body thickness of 1.40 mm, with 1.60 mm maximum overall height including the standoff. The 64 fixes lead count. Body size and pitch are not fixed by the name.

The mechanical definition comes from JEDEC Publication 95 registration MS-026, whose variation letters encode body size, thickness class and lead count. Analog Devices reproduces the registration on its outline drawings: the 64-lead LQFP on a 10 x 10 mm body is marked compliant to MS-026-BCD, and the exposed-pad version is MS-026-BCD-HD. Renesas ties the same 10 x 10 mm 64-lead outline to MS-026 variation ACD in drawing Q64.10x10A, which is the thin variant at 1.20 mm maximum height.

Two practical consequences follow. A drawing marked ACD is a TQFP even when a distributor filter calls it LQFP-64, and the two are height-different but land-pattern-identical. And a part listed only as LQFP-64 tells you nothing about pitch until you open the mechanical section of the datasheet.

LQFP-64 dimensions by body size

Three 64-lead LQFP geometries are in current production. The 10 x 10 mm version dominates microcontroller and Ethernet PHY sockets, and it is the one most CAD libraries mean by LQFP-64.

Body size	Pitch	Lead span	Body / max height	Registration or vendor code	Where you meet it
10 x 10 mm	0.50 mm	12.00 mm +/-0.20	1.40 / 1.60 mm	JEDEC MS-026-BCD	STM32, most 32-bit MCUs, PHYs
14 x 14 mm	0.80 mm	per vendor drawing	1.40 / 1.60 mm	ST package code 1R (TN1206)	Legacy 8-bit and automotive parts
7 x 7 mm	0.40 mm	per vendor drawing	1.40 / 1.60 mm	Holtek 64 (7×7) footprint entry	Space-constrained consumer designs

Lead-frame dimensions for the 10 x 10 mm part, taken from the Analog Devices ST-64-2 and SW-64-2 drawings: lead width 0.17 / 0.22 / 0.27 mm (min / nom / max), foot length 0.45 / 0.60 / 0.75 mm, lead length reference L1 = 1.00 mm, standoff 0.05 / 0.10 / 0.15 mm, lead coplanarity 0.08 mm maximum, and lead angle 0 to 7 degrees. Microchip drawing C04-01080 gives the same pitch and thickness set for its 64-lead 10 x 10 mm LQFP, with overall width E = 12.00 mm and molded width E1 = 10.00 mm.

The coplanarity number is the one that matters at assembly. 0.08 mm is the total allowable deviation of the 64 lead feet from a common seating plane. Tubes and trays that have been dropped routinely produce parts outside it, and a single bent foot on a 0.5 mm pitch part opens one joint without opening its neighbors.

LQFP-64 against TQFP-64 and QFP-64

These three share a lead frame concept and differ in body thickness and, for the older QFP, in pitch. The comparison below uses registration data from the Analog Devices drawings and land-span data from the Holtek footprint guide, revision 1.10 dated 13 August 2025.

Attribute	LQFP-64 (10 x 10)	TQFP-64 (10 x 10)	QFP-64 (14 x 14)
Body thickness	1.40 mm	1.00 mm	2.00 mm class
Max height	1.60 mm	1.20 mm	per vendor drawing
Pitch	0.50 mm	0.50 mm	0.80 mm
JEDEC variation	MS-026-BCD	MS-026-ACD	not MS-026
Land span (Holtek)	11.4 mm BSC	11.4 mm BSC	16.3 mm BSC
Pad size (Holtek)	0.30 x 1.65 mm	0.30 x 1.65 mm	0.50 x 2.25 mm

Because LQFP and TQFP at 10 x 10 mm share the outline, one footprint serves both. Height clearance is the only thing that changes, which matters under a shield can or a stacked board where 0.4 mm decides the stack.

LQFP-64 pinout: numbering and orientation

Pin numbering on a 64-lead LQFP follows the JEDEC quad convention. Pin 1 sits at the top left of the top view, adjacent to the pin-1 index feature, and numbering runs counter-clockwise when viewed from the top with the leads pointing down. Each side carries 16 leads, so the corner pins are 1, 16, 17, 32, 33, 48, 49 and 64. Analog Devices marks exactly this sequence on its 64-lead outlines.

Two orientation errors dominate. Manufacturers show the pinout figure as a top view, and CAD libraries are drawn in the same frame, so a footprint mirrored during a bottom-side placement rotates the part 90 degrees off. And silkscreen pin-1 dots get covered by the body on a 10 x 10 mm part; the reliable marker is a chamfered silkscreen corner outside the courtyard plus a copper or paste asymmetry the AOI camera can see.

Pin functions are device-specific, and the same silicon shifts function across pin counts. On the STM32 line, moving from LQFP64 to LQFP144 splits VREF+ away from VDDA onto its own pin, so an ADC design validated on the larger package does not port pin-for-pin to the 64-lead part. Always cross-check against the pin definition table in the device datasheet, never against a generic LQFP-64 diagram.

LQFP-64 footprint and land pattern

The Holtek footprint guide publishes usable land dimensions for all three geometries. Values are millimeters; D and W are the outer land span across the pattern, x is pad width, y is pad length.

Variant	Pitch (e)	Land span D = W	Pad width x (max)	Pad length y
LQFP-64, 10 x 10 mm	0.50 BSC	11.4 BSC	0.30	1.65
LQFP-64, 7 x 7 mm	0.40 BSC	8.4 BSC	0.25	1.65
QFP-64, 14 x 14 mm	0.80 BSC	16.3 BSC	0.50	2.25

Read the 10 x 10 mm row against the package: a 12.00 mm lead span sitting on an 11.4 mm land span puts roughly 0.30 mm of pad inboard of each lead tip and the remainder under the heel, which is the toe-and-heel split IPC-7355 targets for gull-wing joints. Pad width of 0.30 mm on 0.50 mm pitch leaves 0.20 mm of solder-mask web between adjacent lands, which is inside the capability of most fabricators but worth confirming against your supplier minimum.

In IPC-7351B naming the standard part is QFP50P1200X1200X160-64N: quad flat package, 0.50 mm pitch, 12.00 x 12.00 mm nominal lead span, 1.60 mm height, 64 pins, nominal density. The trailing letter is the density level, and it is the parameter most libraries silently choose for you. M is most material (level A), N is nominal (level B), L is least material (level C).

Which density level to build

• Level A / M: hand rework expected, mixed assembly, or high-reliability class 3 hardware. Longest toe fillet, largest courtyard.
• Level B / N: the default for reflow-assembled commercial boards. Use it unless you have a reason.
• Level C / L: only when placement density forces it and your assembler has confirmed the tighter tolerance on a 0.5 mm pitch part.

Exposed-pad versions

A minority of 64-lead LQFPs carry a thermal pad. Analog Devices SW-64-2 specifies a 5.50 mm square exposed pad on the 10 x 10 mm body, and Microchip drawing C04-3080 Rev A documents a 64-lead LQFP with a 6.2 x 6.2 mm exposed pad and 2.0 mm footprint. Those two pads are 1.2 mm different across the diagonal, so a library footprint built for one will not match the other. Microchip also notes that thermal vias under the pad should be filled or tented, otherwise solder wicks down the barrels during reflow and the joint starves.

Assembly, stencil and shipping

At 0.5 mm pitch the stencil aperture, not the copper, sets the yield. A 1:1 aperture on a 0.30 x 1.65 mm pad deposits enough paste to bridge if the part shifts, so most process engineers pull the aperture back 10 percent on width. Type 3 powder works at this pitch; Type 4 buys margin on the 0.4 mm pitch 7 x 7 mm variant.

Shipping media is a sourcing detail that costs a week when it is wrong. STMicroelectronics technical note TN1206 lists the 10 x 10 mm 64-lead LQFP as package code 5W on 24 mm tape with 16 mm tape pitch on a 13-inch reel, and the 14 x 14 mm 64-lead part as code 1R on 32 mm tape with 24 mm pitch. Infineon ships PG-LQFP-64-4 in trays of 960 pieces per box or on 330 mm reels. Feeder availability at your contract manufacturer follows from those tape widths, not from the package name.

Plastic quad flat packages carry a moisture sensitivity level per J-STD-020 and J-STD-033. Confirm the MSL on the device datasheet before opening a dry pack, and bake per the label rather than per habit, since MSL varies by device and mold compound even inside one package family.

Design mistakes that produce returns

• Choosing an LQFP-64 library part without checking pitch, then landing a 0.8 mm pitch 14 x 14 mm device on an 11.4 mm span footprint.
• Routing a trace between adjacent 0.5 mm pitch lands with only default clearance, leaving no room for solder mask and inviting a bridge.
• Copying an exposed-pad footprint across vendors when the pad steps from 5.50 mm to 6.2 mm square.
• Leaving thermal vias open under the pad, which drains paste into the barrels.
• Trusting a generic pinout drawing instead of the device pin table, which is how VREF+ ends up tied to VDDA on a precision ADC board.

Frequently asked questions

What are the dimensions of an LQFP-64 package?

The common version is a 10 x 10 mm body with a 12.00 mm lead span, 0.50 mm pitch, 1.40 mm body thickness and 1.60 mm maximum height, per JEDEC MS-026 variation BCD. Lead width is 0.22 mm nominal and foot length 0.60 mm nominal. Versions at 14 x 14 mm on 0.8 mm pitch and 7 x 7 mm on 0.4 mm pitch also exist.

What is the difference between LQFP and TQFP?

Body thickness. LQFP is 1.40 mm thick with 1.60 mm maximum height; TQFP is 1.00 mm thick with 1.20 mm maximum height. At 64 leads on a 10 x 10 mm body both use 0.5 mm pitch and the same 12.00 mm lead span, so one land pattern serves both. Only vertical clearance changes.

What is the LQFP-64 footprint size?

Holtek specifies an 11.4 mm BSC land span with 0.30 mm wide by 1.65 mm long pads on 0.50 mm pitch for the 10 x 10 mm part. Courtyard depends on the density level you build: nominal (level B) is the default for reflow assembly. The IPC-7351B name is QFP50P1200X1200X160-64N.

How are LQFP-64 pins numbered?

Pin 1 is at the top left of the top view next to the index feature, and numbering runs counter-clockwise with 16 leads per side. Corner pins are 1, 16, 17, 32, 33, 48 and 64. Manufacturer pinout figures are top views, so a bottom-side placement needs the footprint mirrored rather than rotated.

Can I hand-solder an LQFP-64?

Yes, at 0.5 mm pitch, with flux and drag-soldering or hot air. Build the footprint at IPC density level A so the toe fillet extends past the lead and gives the iron something to wet. The 0.4 mm pitch 7 x 7 mm variant is realistic only with hot air and a good stereo microscope.

What to specify

Default to the 10 x 10 mm, 0.5 mm pitch LQFP-64 built to MS-026-BCD, on a nominal-density land pattern with an 11.4 mm span and 0.30 x 1.65 mm pads. Move to the 7 x 7 mm 0.4 mm pitch version only when board area is the binding constraint and your assembler has quoted the finer pitch. Take the 14 x 14 mm 0.8 mm pitch version when hand assembly, field rework or legacy footprint compatibility outweighs area.

Before release, do three checks: read the package code in the orderable part number and confirm body size; open the vendor mechanical drawing and confirm the exposed pad exists or does not; and confirm the tape width against your feeder list. Those three catch nearly every LQFP-64 respin.

[IMAGE 1: dimensioned top and side view of a 64-lead LQFP on a 10 x 10 mm body showing body size, lead span, pitch and 1.40 mm thickness | alt: “LQFP-64 package dimensions showing 10 x 10 mm body, 12.00 mm lead span and 0.50 mm pitch”]

[IMAGE 2: recommended land pattern for LQFP-64 with 11.4 mm span, pad width and length called out | alt: “LQFP-64 footprint land pattern with 11.4 mm span and 0.30 by 1.65 mm pads”]

[IMAGE 3: top view pin numbering diagram with pin 1 index and corner pins labeled | alt: “LQFP-64 pinout numbering counter-clockwise from pin 1”]

Sources

• Analog Devices, 64-Lead Low Profile Quad Flat Package [LQFP] (ST-64-2) and LQFP_EP (SW-64-2) outline drawings.
• Analog Devices, 64-Lead Thin Quad Flat Package, Exposed Pad [TQFP_EP] (SV-64-5) outline drawing.
• Holtek Semiconductor, Recommended Footprints for QFP Series, User Guide Rev. 1.10, 13 August 2025.
• Microchip Technology, drawing C04-01080 (64-lead LQFP 10 x 10 mm) and C04-3080 Rev A (64-lead LQFP with 6.2 x 6.2 mm exposed pad).
• STMicroelectronics, TN1206, Tape and reel shipping media for STM8 and STM32 microcontrollers in QFP packages.
• Renesas, package outline drawing Q64.10x10A, 64-lead LQFP, Rev 3.
• Infineon Technologies, PG-LQFP-64-4 package page.
• [INTERNAL LINK: PCB footprint creation step by step -> footprint creation method]
• [INTERNAL LINK: paste layer design for thermal pads -> stencil aperture and paste coverage]
• [INTERNAL LINK: FPGA pin swapping and layout-driven I/O assignment -> pin assignment strategy]
• [INTERNAL LINK: panelization tabs and package clearance -> assembly panel design]