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An eSOP package is a small-outline package with the die-attach paddle exposed through the bottom of the mold compound, giving heat a direct path into

The CLCC package is a square ceramic surface-mount package with metallized castellations down its four edges instead of leads, usually on 1.27 mm or 1.02

The CLCC package is a square ceramic surface-mount package with metallized castellations down its four edges instead of leads, usually on 1.27 mm or 1.02

The ZIP package is a through-hole IC package whose leads leave one edge in two staggered rows, letting a 25-lead part occupy half the board

The TO-99 package is an 8-lead hermetic metal can, about 8.5 mm across, with leads on a 5.08 mm circle at 45° spacing. JEDEC registers

The TO-92 package is a three-lead molded plastic body about 4.6 mm across, with leads on 1.27 mm centers and a flat face for orientation.

The TO-8 package is a hermetic metal can roughly 15 mm across the header, taller and wider than a TO-5 and one size below a

The TO-72 package is the four-lead member of the TO-18 metal can family, registered by JEDEC as TO-206AF. Body dimensions match TO-18 exactly; the extra

The TO-5 package is a hermetic metal can with leads on a 5.08 mm pin circle and a locating tab 45° from pin 1. JEDEC registers

The TO-66 package is a hermetic two-lead metal can built on a diamond-shaped mounting flange, registered by JEDEC as TO-213AA, with the case acting as