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A TO-126 package body is nominally 11.0 mm tall, 8.0 mm wide and 3.25 mm thick, with a 3.2 mm mounting hole and 2.28 mm

TO-can packages are hermetically sealed metal cylinders with radial leads, still specified where a plastic body cannot go: rad-hard parts, precision references, laser diodes, and

The through-hole vs surface mount decision is usually framed as old against new. That framing is useless at the bench, because most boards need both.

Stud-mount diode packages bolt a rectifier directly into a heat sink or busbar through a threaded stud, with the hex base carrying heat out of

An SPGA package is a pin grid array whose pins sit on two interleaved square grids, each offset from the other by half a pitch

A skinny DIP package is an ordinary dual in-line package whose two lead rows sit 0.300 in (7.62 mm) apart instead of the wide-body 0.600

A SIP package carries all its leads in one row along a single edge, so the body stands on end when the leads go through

A SIL package puts every lead in one row along one edge of the body, so the part stands upright on the board. SIL and

An SDIP (shrink dual in-line package) is a through-hole DIP with a finer lead pitch than the standard part: 1.778 mm (0.070 in) instead of

In a radial lead package, both leads exit the same face of the component body, so the part stands vertically on the board and takes