Description

What the XCVU9P-2FLGB2104I Is Built For

The XCVU9P-2FLGB2104I sits at the top of AMD Xilinx’s Virtex UltraScale+ line. It uses stacked silicon interconnect (SSI) to join three super logic regions (SLRs) into a single device, which is how it reaches 2.59 million system logic cells in one package. Designs that outgrow a monolithic FPGA — 8K video pipelines, ASIC emulation platforms, network processing at 100GbE — land here.

XCVU9P-2FLGB2104I Key Specifications

How to Read the XCVU9P-2FLGB2104I Part Number

• XC — AMD Xilinx commercial product prefix
• VU9P — Virtex UltraScale+, device size 9P
• -2 — speed grade (mid-tier; -1, -2, -3 available)
• FLG — flip-chip lidded, Pb-free package
• B2104 — package variant B, 2,104 balls
• I — industrial temperature grade

Order the wrong final letter and you get the extended-temperature (E) part instead, which is not a drop-in for industrial qualification paperwork even though the die is identical.

FLGB2104 Package and PCB Design Notes

At 47.5 × 47.5mm on a 1.0mm pitch, this package needs a high-layer-count board with controlled-impedance routing for the GTY lanes. Plan for a stiffener or backing plate: large lidded FCBGAs are sensitive to board flex during reflow and in-system. Power delivery is the other constraint — VCCINT current on a fully utilized VU9P runs high enough that PDN impedance, not logic timing, is often what limits the design.

Why -2 Speed and Industrial Grade

The -2 grade is the volume choice for this device. It gives meaningful Fmax headroom over -1 without the price and availability penalty of -3. The industrial rating extends the junction temperature floor to -40°C, which matters for outdoor 5G radio units, rail, and test equipment that cold-starts.

Design Tools and IP Support

The VU9P requires Vivado ML Enterprise Edition — it is not covered by the free Standard edition licence. Budget for that before quoting a project. Vitis, the UltraScale+ Memory IP for DDR4, and the integrated 100G Ethernet subsystem are all supported. When partitioning across SLRs, place Laguna registers deliberately; automatic SLR crossings are the most common source of timing closure failures on this device.

Applications

• Data center and cloud FPGA acceleration
• ASIC prototyping and hardware emulation
• 5G massive MIMO and baseband processing
• 100G/400G network packet processing
• Machine learning inference offload
• High-end test, measurement, and defense signal processing

XCVU9P-2FLGB2104I FAQ

How is the XCVU9P-2FLGB2104I different from the XCVU9P-2FLGB2104E?
Same silicon, same package, different temperature qualification. The I part is rated -40°C to +100°C junction; the E part is 0°C to +100°C. Choose I for industrial, outdoor, or automotive-adjacent environments.

What is the difference between FLGB2104 and FLGA2104?
Both are 2,104-ball packages with the same body size, but the A and B variants bond out different mixes of user I/O and GTY transceivers. They are not pin-compatible — confirm against the datasheet before reusing a layout.

How many SLRs does the VU9P have?
Three. The device is an SSI part, so cross-SLR paths carry extra latency and need Laguna register placement to close timing.

Does it support PCIe Gen3 x16?
Yes, through integrated hard blocks, alongside 100G Ethernet MAC/PCS and 150G Interlaken cores.

Is it RoHS compliant?
Yes. The G in FLGB indicates a Pb-free, RoHS-compliant package.

Order the XCVU9P-2FLGB2104I

Contact FPGA.io for current pricing, stock, and lead time on the XCVU9P-2FLGB2104I, including partial-reel and single-unit quantities.