TSSOP-64 is a 64-lead thin-shrink small-outline package built to JEDEC MO-153, with a 17.0 mm × 6.1 mm × 1.0 mm body and 0.5 mm lead pitch. It breaks from the more common 4.4 mm-body, 0.65 mm-pitch TSSOP family used up to 56 leads, and ships with or without an exposed thermal pad.

Key takeaways

• Body: 17.0 × 6.1 × 1.0 mm, pitch 0.5 mm — confirmed against Renesas’s own package code PAG64.
• 64-lead TSSOP isn’t a bigger version of the 8- to 56-lead family you already know — it uses a wider 6.1 mm body and a tighter 0.5 mm pitch, not the usual 4.4 mm / 0.65 mm combination.
• There’s no universal “TSSOP-64 pinout.” Pin numbering (1 through 64) is fixed by the mechanical outline; which pin does what is set by whatever IC you’re actually using.
• Peak reflow is rated to 260°C per J-STD-020 on at least one real device in this package — check your specific part’s MSL before you commit to a profile.
• 64-lead TSSOP is closer to a vendor-specific outline than a broad multi-source commodity package — don’t assume drop-in mechanical compatibility across manufacturers without checking.

Mechanical Dimensions

The clearest verified source for exact TSSOP-64 numbers is Renesas’s own package database, which lists the outline under package code PAG64:

Parameter	Value
Package type	TSSOP (JEDEC MO-153 family)
Package code	PAG64
Lead count	64
Body length (D)	17.0 mm
Body width (E)	6.1 mm
Body height / seated max	1.0 mm
Lead pitch (e)	0.5 mm
Lead finish	Pb-free, e3 Sn
Peak reflow temperature	260°C
Shipping carrier	Reel, tube

Independent distributor/prototyping sources agree on the core envelope: both Chip Quik and Proto Advantage describe their TSSOP-64-to-DIP adapter boards using the identical “17 × 6.1 mm body, 0.5 mm pitch” figures, which cross-checks the Renesas number against unrelated, commercially motivated sources rather than one self-reported spec sheet.

Why TSSOP-64 Breaks From “Standard” TSSOP

Most engineers’ mental model of TSSOP is 4.4 mm body width, 0.65 mm pitch, 8 to somewhere in the 50s of leads. That model holds up on distributor sites — DigiKey’s “56-TSSOP” category filter is the highest narrow-body TSSOP lead count that shows up as a generic, multi-vendor filterable option, and the 4.4 mm/0.65 mm combination is what a general TSSOP glossary describes as the “standard” pitch topping out at 56 leads.

TSSOP-64 doesn’t extend that family — it switches to the 6.1 mm-body branch of the same JEDEC MO-153 outline group, and drops pitch to 0.5 mm to fit 64 leads into a body that’s still only 17 mm long. In other words, going from 56 to 64 leads isn’t a small step up in the same package — it’s a different body/pitch combination entirely, and your footprint, stencil, and pick-and-place programming all need to reflect that.

Attribute	TSSOP-64	Standard narrow TSSOP (≤56 lead)	TQFP-64 (PowerPAD)
Lead sides	2 (gull-wing)	2 (gull-wing)	4 (gull-wing)
Body (L × W × H)	17.0 × 6.1 × 1.0 mm	4.4 mm width fixed; length scales with lead count	14 × 14 × 1.0 mm
Lead pitch	0.5 mm	0.65 mm	0.5 mm
Practical lead-count ceiling	Vendor-specific; 64 seen in production parts	~56 across the generic distributor catalog	Widely available past 64
Exposed pad option	Yes, on some devices	Model-dependent	Yes (PowerPAD)

Worked calculation — board area: TSSOP-64’s body footprint is 17.0 × 6.1 = 103.7 mm². TQFP-64 with an exposed PowerPAD, per Texas Instruments’ own thermal application note, is 14 × 14 = 196 mm². TSSOP-64 uses roughly 47% less board area than the PowerPAD TQFP-64 for the same 64 leads — but that area comes in a long, narrow strip rather than a square, so it’s a real trade-off in aspect-ratio-constrained layouts, not a free win.

Pin Numbering vs. “Pinout” — What’s Actually Fixed

This is where most generic package pages quietly mislead you. The mechanical numbering of a TSSOP-64 body is fixed by the outline standard: viewed from the top with the pin-1 index mark (dot or notch) at the upper left, pins run 1 through 32 down the left side and 33 through 64 up the right side — the standard counter-clockwise convention used across gull-wing SOP-family packages.

What is not fixed is which signal sits on which pin. TSSOP-64 is a mechanical outline, not a device — it’s used by unrelated chips with completely different pin functions. As a concrete example, THine Electronics’ THC63LVD1027, a dual-link LVDS repeater used to move pixel data between a host and an LVDS flat-panel display, ships in this exact 64-pin TSSOP outline with an exposed pad. Its pin-1 orientation and 1–64 numbering follow the standard convention above, but the actual signal on, say, pin 12 has nothing in common with whatever a different manufacturer put on pin 12 of an unrelated TSSOP-64 device. Always pull the function-to-pin table from your specific part’s datasheet — “TSSOP-64 pinout” as a generic search is really asking two separate questions, and only the numbering half has a single answer.

Footprint and Land Pattern

Because TSSOP-64 uses a non-default pitch (0.5 mm) and body (6.1 mm) inside the wider MO-153 family, don’t reuse a land pattern generated for a 0.65 mm-pitch TSSOP — the pad pitch, pad width, and courtyard will all be wrong.

• Pad pitch must match the lead pitch exactly: 0.5 mm, center to center.
• Pad count and layout follow the two-row, 32-per-side arrangement described above.
• Toe, heel, and side fillet should follow whatever land-pattern density level (Most/Nominal/Least material condition, in IPC-7351 terms) your assembly process and DFM rules call for — this is a process decision, not a fixed number.
• Exposed-pad variants need an additional center pad sized to the specific device’s thermal/ground pad, plus a via pattern if you’re using it for heat spreading — pull that dimension from the specific part’s package drawing.

The reliable path is the manufacturer’s own land-pattern drawing or CAD footprint — Renesas’s PAG64 package page and most vendor datasheets publish one alongside the mechanical outline — rather than approximating one from a generic TSSOP-family footprint generator that wasn’t built around the 6.1 mm/0.5 mm combination.

Soldering, Reflow, and Handling

The PAG64 listing specifies a 260°C peak reflow temperature, consistent with J-STD-020 classification for a lead-free small-outline package. That’s a device-level rating tied to moisture sensitivity level (MSL) — always confirm MSL and the exact reflow profile against your specific part’s datasheet before locking a stencil and oven profile, since two different chips in the same TSSOP-64 outline can carry different MSL ratings.

At 0.5 mm pitch, hand-soldering is meaningfully harder than the 0.65 mm-pitch TSSOP family most engineers are used to hand-touching up. It’s doable with a fine-tip iron, flux, and a drag-soldering technique, but for production quantities, reflow (or hot air with a stencil for rework) is the realistic path — 32 leads per side at 0.5 mm spacing leaves very little margin for solder bridging if you’re working freehand.

A Real TSSOP-64 Part: THC63LVD1027

Concrete example over abstraction: THine Electronics’ THC63LVD1027 is a dual-link LVDS repeater that reforms and redistributes LVDS pixel data between a host and a flat-panel display, supporting resolutions up to 1080p/UXGA. It ships in a 64-pin TSSOP with an exposed pad and 0.5 mm lead pitch — LCSC lists the same part under the alternate designation TFSOP-64-EP-6.1mm, a useful confirmation that the exposed-pad, 6.1 mm-body variant is what you’re actually getting. DigiKey currently lists the THC63LVD1027-B variant at roughly $13.53 per unit in low quantity — useful as a real cost-and-availability data point rather than a guess, though check current pricing before you build a BOM around it.

For an FPGA-adjacent audience, this is a genuinely useful reference point: LVDS repeaters/deserializers like this one are a common reason to end up routing a TSSOP-64 footprint in the first place, ahead of an FPGA’s own LVDS input banks for panel or camera interfacing.

When to Choose TSSOP-64 vs. the Alternatives

• You need more than ~56 gull-wing leads but still want a two-row, hand-inspectable, relatively low-cost package → TSSOP-64 is a reasonable fit, provided your target device is actually offered in it.
• You need a denser, more square footprint, or expect to go well past 64 I/O → TQFP or QFN in the same lead-count range is more common and better second-sourced across vendors.
• You need maximum I/O density and don’t mind a BGA assembly process (more layers, X-ray inspection) → BGA territory, outside the scope of a TSSOP comparison.

Second-Source and Availability Notes

Unlike the 8- to 56-lead TSSOP family, which is offered as a generic, interchangeable outline across dozens of manufacturers and is directly filterable on major distributor sites, 64-lead TSSOP shows up in the real catalog tied to specific parts and specific vendor package codes (Renesas’s PAG64 being one documented example). Before you assume mechanical drop-in compatibility between two different manufacturers’ “TSSOP-64” parts, pull both package drawings and confirm body, pitch, and — critically — exposed-pad presence and size match. Treat it as a part-specific outline you’re verifying, not a generic commodity footprint you can assume.

FAQ

What is the body size of a TSSOP-64 package?

17.0 mm × 6.1 mm × 1.0 mm nominal, with a 0.5 mm lead pitch, per Renesas’s PAG64 package listing. Always confirm against your specific device’s datasheet, since minor tolerances can vary by manufacturer.

Is TSSOP-64 the same as SSOP-64?

No. TSSOP is thinner — typically 1.0–1.2 mm max height versus roughly double that for SSOP — even where pitch values overlap. Don’t substitute one footprint for the other.

Does TSSOP-64 always have an exposed pad?

No. Some devices, like THine’s THC63LVD1027, ship with an exposed pad for thermal/ground performance; the JEDEC MO-153 outline itself doesn’t require one. Check your specific part.

What’s the maximum reflow temperature for TSSOP-64?

At least one production device in this package is rated to 260°C peak, consistent with J-STD-020 lead-free classification. MSL and exact profile are device-specific — verify against your part’s datasheet.

Can TSSOP-64 be hand-soldered?

Yes, but the 0.5 mm pitch makes it noticeably harder than the more common 0.65 mm TSSOP family. Drag soldering with flux works for rework; reflow is the realistic path for production.

What is TSSOP-64 typically used for?

Devices needing more gull-wing leads than the ~56-lead ceiling of the standard narrow TSSOP family, in a still hand-inspectable two-row package — LVDS repeaters and deserializers for display/camera interfacing are one documented real-world example.

What to Do Next

Don’t build a footprint from memory or from a generic TSSOP template. Pull the package section of your actual part’s datasheet, confirm it matches the 17.0 × 6.1 × 1.0 mm / 0.5 mm envelope above (or documents a deviation), grab the manufacturer’s land-pattern CAD file rather than approximating one, and check MSL/reflow profile before your first build. If your part doesn’t publish its own land pattern, verify body and pitch against the numbers here before you generate one, and confirm exposed-pad dimensions separately if your device has one.

Suggested internal links

• TSSOP vs SSOP vs QFP package comparison → package selection guide
• How to read a JEDEC package outline drawing → package fundamentals
• IPC-7351 land pattern basics → PCB footprint design
• LVDS interfacing for FPGA display outputs → FPGA video interfacing

External sources referenced

Renesas PAG64 package page · THine Electronics THC63LVD1027 product page · THine THEVA1027 evaluation-kit documentation (hosted on Mouser) · DigiKey THC63LVD1027-B listing · LCSC THC63LVD1027 listing · Texas Instruments PowerPAD thermal application note (SLMA002)