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A PGA socket connects a pin grid array device to a board through the device’s underside pins, with no soldering of the device itself. Three

A PGA, or pin grid array, is an IC package with pins arranged in a regular grid on the underside, mounted by inserting those pins

The PDIP package is a Plastic Dual In-line Package: a through-hole IC body with two parallel rows of pins on a 2.54 mm (0.1 in)

The mPGA package is a micro pin grid array: a pin grid array built on a reduced 1.27 mm (50-mil) pin grid, half the pitch

The FCPGA package is a flip-chip pin grid array: a socketed processor package with pins on the bottom and a die mounted face-down on the

The DO-9 package is a JEDEC stud-mount rectifier outline, registered today as DO-205AB. It carries hermetic silicon power diodes rated roughly 200 A to 480

The DO-8 package is a JEDEC stud-mount rectifier outline, registered today under the name DO-205AA. It houses hermetic, high-current power diodes rated around 150 A

The DO-5 package is JEDEC outline DO-203AB: an 11/16 in hermetic hex with a 1/4-28 UNF stud and a flexible pigtail, holding rectifier dies rated 35

A DO-41 package body measures 4.10 mm to 5.20 mm long and 2.00 mm to 2.70 mm in diameter, with 0.71 mm to 0.86 mm leads

The DO-4 package is a threaded-stud diode outline: a 10-32 UNF-2A stud on one face, a 7/16 in hermetic hex body, and a flexible pigtail lead