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The DIP-14 package is a 14-pin dual in-line through-hole IC housing with 300 mil (7.62 mm) row spacing, 2.54 mm pin pitch, and a body

DIP sockets are through-hole receptacles that accept dual in-line package ICs without soldering the IC directly to the board. They allow chip insertion, removal, and

DIP pin spacing follows one universal rule and three row-width standards. Every standard DIP package uses a 2.54 mm (0.1” / 100 mil) center-to-center pitch

The DIP package (Dual In-Line Package) is an IC housing with two parallel rows of through-hole pins extending from a rectangular body. Invented at Fairchild

The CPGA package (Ceramic Pin Grid Array) is a hermetically sealed through-hole IC housing that places pins in a full area array across the underside

The CERDIP package (also written CerDIP) is a hermetically sealed ceramic dual in-line package in which a pressed-ceramic lid is bonded to a pressed-ceramic base

The CDIP package (Ceramic Dual In-Line Package), also called CerDIP, is a hermetically sealed through-hole IC housing built from pressed alumina ceramic and closed with

Axial lead packages are through-hole electronic components whose wire leads extend from opposite ends of the body along its longitudinal axis. They are the dominant

Transistor package types determine how a discrete semiconductor connects to your PCB, dissipates heat, and survives its operating environment. The two dominant families are TO

Through-hole packages mount electronic components by inserting metal leads through drilled holes in a PCB and soldering them on the opposite side. Despite the dominance